Baking

Components are baked @ 125C for 24 hours in the facility here in South Florida.

Co-planarity Inspection

Inspection of Gull Wing, J-lead and Ball Grid Array devices on JEDEC standard trays. 3D-Technology

Component Marking

We can offer many different marking systems for all types of applications. We offer label and laser marking services, as well as vision inspection systems. Complete service of label application systems for integrated circuits and SIMM/DIMM modules. Apply labels safely, accurately and quickly to BGA's, QFP,s, TSOP,s, PGAs, etc.