ED241DT 24-Position DIP Socket With Dual-Wipe Tin Contacts

ED241DT is a practical choice for prototypes, serviceable assemblies, and through-hole designs where IC swap-out is expected. The dual-wipe contact style improves retention and helps maintain contact integrity during vibration and repeated insertions. ED241DT uses a stamped socket design with a closed-bottom approach to reduce solder wicking during assembly. It is rated for 1 A, with contact resistance specified at 20 mΩ, supporting stable low-level signals and typical logic loads. The datasheet lists dielectric strength greater than 1000 V (RMS), supporting isolation requirements inside mixed-signal layouts. ED241DT is designed for through-hole soldering and common DIP spacing practices. Use it to keep rework clean and to protect IC leads from heat exposure. Request a quote for ED241DT.